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  • 电路板贴片加工有哪些步骤?
  • 本站编辑:杭州喜锦电子科技有限公司发布日期:2018-07-19 16:15 浏览次数:

SMT贴片加工10

电路板贴片加工工艺流程
Process flow of PCB patch processing
丝印:其作用是将焊膏或贴片胶漏印到PCB的焊盘上,为元器件的焊接做准备。所用设备为丝印机(丝网印刷机),位于SMT生产线的前端。
Screen printing: its role is to solder paste or patch glue to the PCB pad to prepare for the welding of components. The equipment used is screen printer (screen printing machine), which is located at the front end of SMT production line.
点胶:它是将胶水滴到PCB的的固定位置上,其主要作用是将元器件固定到PCB板上。所用设备为点胶机,位于SMT生产线的前端或检测设备的后 面。
Dispensing: it is the glue drops to the fixed position of PCB, its main function is to fix the components to the PCB board. The equipment used is dispensing machine, which is located at the front end of SMT production line or behind the detection equipment.
贴装:其作用是将表面组装元器件准确安装到PCB的固定位置上。所用设备为贴片机,位于SMT生产线中丝印机的后面。
Mounting: its function is to install the surface mount components accurately to the fixed position of PCB. The equipment used is placement machine, which is located behind the screen printing machine in SMT production line.
固化:其作用是将贴片胶融化,从而使表面组装元器件与PCB板牢固粘接在一起。所用设备为固化炉,位于SMT生产线中贴片机的后面。
Curing: the function is to melt the adhesive, so that the surface mount components are firmly bonded to the PCB board. The equipment used is a curing oven, which is located behind the placement machine in the SMT production line.
回流焊接:其作用是将焊膏融化,使表面组装元器件与PCB板牢固粘接在一起。所用设备为回流焊炉,位于SMT生产线中贴片机的后面。
Reflow soldering: its role is to melt solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is reflow furnace, located behind the placement machine in the SMT production line.
清洗:是将组装好的PCB板上面的对人体有害的焊接残留物如助焊剂等除去。所用设备为清洗机,位置可以不固定,可以在线,也可不在线。
Cleaning: remove the harmful welding residues such as flux from the assembled PCB board. The equipment used for the washer is not fixed, it can be online or online.
检测:其作用是对组装好的PCB板进行焊接质量和装配质量的检测。所用设备有放大镜、显微镜、在线测试仪(ICT)、飞针测试仪、自动光学检测(AOI)、X-RAY检测系统、功能测试仪等。位置根据检测的需要,可以配置在生产线合适的地方。
Detection: its function is to detect the welding quality and assembly quality of the assembled PCB board. The equipment used are magnifying mirror, microscope, on-line test instrument (ICT), flying needle tester, automatic optical detection (AOI), X-RAY detection system, function test instrument and so on. Location can be configured in the right place of production line according to the need of testing.
返修:其作用是对检测出现故障的PCB板进行返工。所用工具为烙铁、返修工作站等。配置在生产线中任意位置。
Repair: its function is to reinspect the malfunctioning PCB board. The tools used are the soldering iron, the repair workstation and so on. Configure at any position in the production line.

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